SK Hynix Set to Produce HBM4 Memory for NVIDIA and AMD, Based on 1b nm DRAM Technology
South Korean memory giant SK Hynix is reportedly gearing up to manufacture High-Bandwidth Memory 4 (HBM4) for key clients NVIDIA and AMD, according to sources cited by ZDNet Korea. The company is expected to initiate the production of HBM4 memory for both GPU manufacturers later this year, with NVIDIA’s version entering the tape-out phase in October and AMD’s following by the end of 2024.
SK Hynix has assembled dedicated HBM4 development teams for its two major HBM memory clients, signaling its commitment to meeting their high-performance demands. While rival Samsung Electronics plans to utilize 1c nm DRAM technology for HBM4 to enhance energy efficiency, SK Hynix has chosen to stick with the proven 1b nm DRAM technology, which has already been tested in its HBM3E offerings, in order to ensure stability.
In the HBM4’s base die (also known as the logic chip or interface chip), SK Hynix will incorporate both TSMC’s N12FFC+ cost-effective products and N5 high-performance products. The decision to collaborate with TSMC for this critical component showcases the strategic partnerships forming within the semiconductor industry.
Notably, NVIDIA’s upcoming high-performance AI GPU, codenamed Rubin, which is expected to be part of the post-Blackwell generation, is rumored to feature 12-layer stacked HBM4 memory. This highlights the increasing reliance on advanced memory solutions in next-generation AI processing.
In the competitive landscape, it’s worth mentioning that SK Hynix’s main rival, Samsung Electronics, is also set to initiate the tape-out process for its HBM4 memory in 2024. The race to develop and deliver cutting-edge memory solutions underscores the fierce competition in the semiconductor sector, especially as GPU manufacturers push the boundaries of performance and efficiency.
HBM4 memory represents a significant step forward in high-speed data transfer, offering increased bandwidth and reduced power consumption compared to its predecessors. Its adoption by leading GPU manufacturers like NVIDIA and AMD is expected to further fuel advancements in fields such as artificial intelligence, data centers, and high-performance computing.
With both SK Hynix and Samsung investing in HBM4 development, the memory market is poised for another round of technological leapfrogging. The choice of different DRAM technologies by the two companies highlights the varying approaches to balancing performance, efficiency, and reliability in the highly competitive semiconductor market.
In conclusion, the collaboration between SK Hynix and leading GPU manufacturers signals the continued evolution of memory technologies in the pursuit of ever-greater performance gains. As these partnerships take shape, the industry can anticipate a new wave of innovative products that will shape the future of computing, AI, and data processing.
This article is based on the latest information from ZDNet Korea and IT之家, detailing SK Hynix’s plans to produce HBM4 memory for NVIDIA and AMD using 1b nm DRAM technology. The move underscores the strategic decisions being made by memory manufacturers in response to the demands of high-performance computing and the competitive landscape within the semiconductor industry.
【source】https://www.ithome.com/0/791/269.htm
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