台积电加码 CoWoS 封装产能，未来五年复合增长率超 50%
据 IT之家 1 月 20 日消息，台积电管理层去年 7 月承诺，到 2024 年年底，CoWoS 芯片的封装产能提高一倍，以满足人工智能系统加速器需求增长。近日在财务会议中，台积电表示明年将继续提高产能，未来五年 CoWoS 领域的年复合增长率将超过 50%,并已准备新一代 CoWoS 封装。
台积电首席执行官魏哲家表示，芯片封装服务的需求非常高，目前无法满足客户的需求，这种供不应求的情况将持续到 2025 年。他还表示：“我们正在积极努力提高产能，即便今年 CoWoS 芯片的封装产能提高一倍，可能依然无法满足要求，因此明年我们将进一步增加产能”。
魏哲家还表示台积电过去十多年来一直在投资相关技术，并预估未来五年 CoWoS 领域的年复合增长率将超过 50%,台积电完全有能力满足客户的所有要求。据悉，台积电计划在 2024 年投入 280-320 亿美元(约合人民币 1600-1900 亿元)扩大产能和开发新技术，其中 10%左右的资金用于封装。
封装成本与去年的成本大致相当，由此可以得出结论，核心产能的扩张将以线性方式进行，不会出现生产率的急剧跃升。这一消息无疑为台积电在未来几年的发展带来了新的机遇，也显示出其在封装技术领域的实力和信心。
随着人工智能、物联网等技术的快速发展，对芯片封装的需求也在不断增加。台积电此次加大 CoWoS 封装产能的投资，有望进一步提升其在全球市场的竞争力，为客户提供更优质的产品和服务。同时，这也将有助于推动整个半导体行业的技术创新和发展。
英语如下：
Title: TSMC Boosts CoWoS Encapsulation Capacity, Compound Growth Rate Over 50% for Next Five Years
Keywords: TSMC, CoWoS, Capability
According to ITHome’s report on January 20th, TSMC management promised in July last year that by the end of 2024, the encapsulation capacity of CoWoS chips would double to meet the growing demand for AI system accelerators. At a financial conference recently, TSMC said it would continue to increase production capacity next year and that the compound growth rate for CoWoS will exceed 50% over the next five years. It is also ready for the next generation of CoWoS encapsulation.
TSMC CEO Wei Zhejia said that the demand for chip packaging services is very high and it cannot meet customer needs at present. This supply-demand imbalance will continue until 2025. He also said, “We are actively working to increase production capacity. Even if the encapsulation capacity of CoWoS chips doubles this year, it may still not be able to meet the requirements, so we will further increase production capacity next year.”
Wei Zhejia also said that TSMC has been investing in related technologies for more than ten years and estimated that the compound growth rate for CoWoS will exceed 50% over the next five years. TSMC is fully capable of meeting all customer requirements. It is reported that TSMC plans to invest $28-32 billion (approximately 160-190 billion RMB) in expanding capacity and developing new technologies by 2024, of which about 10% is used for packaging.
The packaging cost is roughly equivalent to last year’s cost, which can conclude that the expansion of core capacity will proceed linearly without a sharp jump in productivity. This news undoubtedly brings new opportunities for TSMC’s development in the next few years and demonstrates its strength and confidence in the field of packaging technology.
With the rapid development of technologies such as artificial intelligence and the Internet of Things, the demand for chip packaging is also increasing. TSMC’s investment in boosting its CoWoS encapsulation capacity is expected to further enhance its competitiveness in the global market, providing customers with better products and services. At the same time, this will also help promote technological innovation and development in the entire semiconductor industry.
【来源】https://www.ithome.com/0/746/331.htm
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