据 TrendForce 发布的晶圆代工市场 23Q3 报告，台积电市场占有率达到 58%，进一步扩大领先地位。而英特尔的 IFS 首次进入全球前十大晶圆代工厂榜单。2023 年第三季度，前十大晶圆代工业者产值为 282.9 亿美元，环比增长 7.9%。其中，台积电第三季营收环比增长 10.2%，达到 172.5 亿美元（当前约 1236.83 亿元人民币），而且其中 3nm 占比达 6%。受益于高通中低端 5G AP SoC 以及 5G mode 订单，再加上成熟的 28nm OLED DDI 等订单加持，三星代工业务第三季营收达到 36.9 亿美元（当前约 264.57 亿元人民币），环比增长 14.1%。除此之外，格芯第三季晶圆出货和平均销售单价持平第二季，营收约为 18.5 亿美元（当前约 132.65 亿元人民币）。联电虽然得到了急单支撑，但整体晶圆出货仍小幅下跌，营收环比减少 1.7% 至约 18 亿美元（当前约 129.06 亿元人民币），其中 28/22nm 营收季增近一成、占比上升至 32%。由于智能手机等相关急单，中芯国际第三季营收环比增长 3.8%，达 16.2 亿美元（当前约 116.15 亿元人民币）。TrendForce 分析师还提到，在本土采购以及中国手机品牌订单激增的推动下，来自中国客户的收入份额大幅上升至 84%，但华为海思麒麟 9000S 并未贡献太多数据。值得一提的是，英特尔代工业务 IFS 受益于下半年笔记本电脑的季节性因素，加上自身先进制程贡献，第三季营收环比增长约 34.1% 至约 3.1 亿美元（当前约 22.23 亿元人民币），首次进入 Top10。
新闻翻译：
Title: Taiwan’s TSMC leads global chipmaking market with 58% market share, while Intel debuts in top 10
Keywords: TSMC, Intel, chipmaking market
News content:
According to the TrendForce report on the global chipmaking market, Taiwan’s TSMC leads the market with a market share of 58%, further expanding its lead. Meanwhile, Intel’s IF 斯首次 enters the top 10 list of global chipmaking factories. In the third quarter of 2023, the top 10 chipmaking companies generated a total of $282.9 billion in revenue, a year-on-year increase of 7.9%. Among them, TSMC’s third-quarter revenue reached $17.25 billion, up 10.2% from the previous quarter, and its 3nm technology 占比达到 6%. benefiting from orders for mid-range 5G AP SoCs and 5G mode orders, as well as mature 28nm OLED DDI orders, Samsung’s third-quarter revenue reached $36.9 billion, a year-on-year increase of 14.1%. In addition, GF’s third-quarter wafers shipped and average selling price remained flat, with revenue of about $18.5 billion, a year-on-year increase of 0.3%. Leung Ka-shing, despite receiving strong orders, experienced a slight decline in overall wafers shipped, with revenue of about $18 billion, a year-on-year decrease of 1.7%, and its 28/22nm revenue accounted for 32%. Due to smartphone and other high-priority orders, China’s customers’ revenue share increased significantly to 84%, but the Huawei HiSilicon 9000S did not contribute much data.值得一提的是，Intel’s IF 斯 benefited from the seasonal factors of the third quarter of laptops, combined with its advanced manufacturing process, and its revenue in the top 10 increased by about 34.1% to about $3.1 billion.
【来源】https://www.ithome.com/0/738/322.htm
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