Santa Clara, CA – Intel is making significant strides in its foundry business, announcing advancements in its cutting-edge process technologies and advanced packaging solutions. At the Intel Foundry Direct Connect 2025 event held in San Jose, California, Intel CEO Pat Gelsinger outlined the company’s progress, highlighting the upcoming 14A process node and a new X3D technology based on the 18A process.
14A Node: High-NA EUV on the Horizon
Intel is already engaging with key customers for its upcoming 14A process node, the successor to the 18A node. The 14A node, equivalent to a 1.4nm process, is slated to be the industry’s first to utilize High-NA EUV (Extreme Ultraviolet) lithography technology, a critical step in pushing the boundaries of semiconductor manufacturing. Several customers are planning to tape out 14A test chips, incorporating Intel’s enhanced backside power delivery technology, PowerDirect.
While TSMC’s competing A14 node is expected in 2028, it is not anticipated to use High-NA technology in production. Intel’s aggressive roadmap positions them to potentially take the lead in advanced process technology.
18A Node: Risk Production Underway
The crucial 18A node is now in risk production, with mass production expected to begin later this year. This node represents a significant milestone for Intel as it aims to regain process leadership.
18A-PT: Intel’s Answer to 3D V-Cache
Intel also unveiled a new 18A-PT variant, supporting Foveros Direct 3D, which utilizes hybrid bonding interconnects. This technology enables Intel to vertically stack wafers on its most advanced nodes, a capability that directly competes with TSMC’s technology used in AMD’s 3D V-Cache products. Intel claims its implementation matches TSMC’s in key interconnect density measurements. This move signifies Intel’s commitment to competing in the high-performance computing market.
Mature Nodes and Foundry Partnerships
Intel Foundry is also making progress in mature nodes, with its first 16nm production wafers now available. The company is collaborating with United Microelectronics Corporation (UMC) to develop a 12nm node, expanding its foundry offerings.
Roadmap and Packaging Innovations
According to Intel’s official roadmap, the 18A-P (performance-enhanced version of 18A) is slated for a 2026 release, while the 18A-PT will follow in 2028. The 14A node is expected in 2027, along with a 14A-E variant.
Intel Foundry offers system-level integration based on Intel 14A on Intel 18A-PT, connected via Foveros Direct (3D stacking) and Embedded Multi-die Interconnect Bridge (EMIB) for 2.5D bridging. New advanced packaging technologies include EMIB-T for future high-bandwidth memory needs, and two new additions to the Foveros architecture: Foveros-R and Foveros-B, providing customers with flexible options.
Manufacturing Expansion
Intel’s Fab 52 in Arizona has achieved a full process run, marking the processing of the first wafer through the facility. Mass production of Intel 18A will commence at Intel’s Oregon facility, with manufacturing in Arizona expanding later this year.
Conclusion
Intel’s announcements at the Intel Foundry Direct Connect 2025 event demonstrate the company’s commitment to regaining process leadership and expanding its foundry business. The advancements in process technology, particularly the 14A node with High-NA EUV, and the introduction of Foveros Direct 3D for vertical stacking, position Intel to compete effectively in the high-performance computing market. The company’s manufacturing expansion and strategic partnerships further solidify its position as a major player in the global semiconductor industry. The next few years will be crucial as Intel executes its roadmap and brings these technologies to market. The industry will be watching closely to see if Intel can successfully challenge TSMC and Samsung for process leadership.
References:
- IT之家. (2024, April 30). 英特尔版 X3D 技术将至：18A-PT 芯片工艺官宣，14A 节点即将推出 [Intel’s X3D Technology is Coming: 18A-PT Chip Process Announced, 14A Node is Coming Soon]. Retrieved from [Insert Original Article Link Here – Since I don’t have the actual link, replace this with the real one]
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